Characterization of parylene-C film as an encapsulation material for neural interface devices
- Hsu, Jui-Meia; Kammer, Saschab; Jung, Erikc; Rieth, Lorend; Normann,A. Richarde; Solzbacher, Florianade (Utah)
- lists Tg 35-80C for parylene-C;
- 3um films applied.
- Parylene samples were subjected to accelerated lifetime testing (85 % relative humidity (RH) and 85 ÌŠC) for 20 days, and the film did not show appearance changes as observed by optical microscopy. However, X-ray diffractograms show that the film crystallinity increased during this test.
- 120C 100%RH for 2 hours released parylene from the silicon.
- Soldering @ 350C backside of Utah array caused parylene to crack.
- X-ray diffraction shows that heat causes parylene to crystalize:
-
___Low Dielectric Constant Materials for Ic Applications___ edited by Paul Shin Ho, Jihperng Leu, Wei William Lee
- Aging and annealing increase crystalinity and thus lower the elongation to break and increase the modulus and mechanical strength of the films.
- parylene-N is considerably more crystaline (57%), Tg 13C. (low!)
- Bulk barrier properties are among the best of the organic polymeric coatings.
|