Adhesion Properties of Electroless-Plated Cu Layers on Polyimide Treated by Inductively Coupled Plasmas
- O2 then N2/H2 ICP treatment of polyimide surfaces dramatically lowers the surface energy (as measured by contact angle), and increases the adhesion of palladium-catalyzed electroless copper.
- Particularly, C-N bonds are increased as revealed by XPS.
- No peel-strength measurements given.
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