{1244} revision 0 modified: 06-28-2013 01:50 gmt

PMID-22719725 Photosensitive-polyimide based method for fabricating various neural electrode architectures

  • Yasuhiro X. Kato,1,* Shigeto Furukawa,2 Kazuyuki Samejima,1 Naoyuki Hironaka,2 and Makio Kashino2
  • many typos in this paper (not that I should talk..) Yet still, it's informative.
  • 12um thick photosensitive polyimide + Cr/Au fabrication.
  • Wet etch (photodeveloper).
  • Wet release (ferric chloride) from glass substrate.
  • Soldered a connector to the polyimide w/ stiffener.
  • Note that polyimide tends to shrink (up to 29%) during baking, unlike parylene!
  • Suggest 20-40um diameter neural recording sites; they did not coat.