{1251} revision 1 modified: 03-03-2015 00:33 gmt

IEEE-938305 (pdf) High Density Interconnects and flexible hybrid assemblies for active biomedical implants

  • Idea: make vias in your metallized PI film. Bump-bond through these vias to a chip below.
  • Achieve center-to -center distances of 100um.
  • No longer using this? See {1250}, which uses thermosonic bonding.