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ref: -0 tags: polyimide adhesion oxygen nitrogen plasma surface energy date: 03-10-2014 22:33 gmt revision:0 [head]

Adhesion Properties of Electroless-Plated Cu Layers on Polyimide Treated by Inductively Coupled Plasmas

  • O2 then N2/H2 ICP treatment of polyimide surfaces dramatically lowers the surface energy (as measured by contact angle), and increases the adhesion of palladium-catalyzed electroless copper.
  • Particularly, C-N bonds are increased as revealed by XPS.
  • No peel-strength measurements given.