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ref: -0 tags: polyimide adhesion aluminum integrated circuit date: 05-07-2014 19:29 gmt revision:0 [head]

Polyimide insulators for multilevel interconnections Arthur M. Wilson

  • Old article (1981), but has useful historical information on the development of various PI insulators and their adhesion to aluminum, SiOx, etc.
  • Suggests that a higher-temperature cure (400C) is needed to fully drive water from the PI & cause a glass-transition. Might want to do this for the second PI layer.