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ref: -0 tags: tantalum chromium polyimide adhesion date: 06-24-2015 23:20 gmt revision:1 [0] [head]

Tantalum and chromium adhesion to polyimide. Part 2. Peel and locus of failure analyses

  • CF4 etch followed by Ar sputter yielded the strongest bond to the PI.
  • Suggest that failure may be within the PI (cohesive), not between the PI and metal (adhesive).

Tantalum, tantalum nitride, and chromium adhesion to polyimide: effect of annealing ambient on adhesion

  • The peel adhesion at T-0 (initial) shows the following order: TaNx∼ TaN < Ta∼ Cr, with all samples failing in apparently virgin PI.
  • After ten thermal cycles to 400°C
    • in forming gas the peel adhesion showed the following trend: TaNx < TaN∼ Ta ∼ Cr,
    • whereas if the annealing was done in N2 the order changed to TaNx∼ TaN « Ta < Cr.
  • The peel locus of failure was
    • always in the apparently virgin PI in the Cr/PI samples,
    • while the Ta/PI samples failed in the modified PI,
    • and the TaN/PI and TaNx/PI samples failed between the Ta-nitride and the Cu peel backing film after thermal cycling.