PMID-16003903[0] Development of a chipscale integrated microelectrode/microelectronic device for brain implantable neuroengineering applications.
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- They have mated a 16-channel silicon microprobe to a low-power (50uW/channel) VLSI chip, including a CMOS amplifier.
- Epoxy ball-bond.
- 7mW total power.
- Suggest photovoltaic power using GaAs/AlGaAs photodiodes. 3 in series yielding 3V at about 20% efficiency. Not bad! Then they can use the fiber to get data out, too.
____References____
[0] Song YK, Patterson WR, Bull CW, Beals J, Hwang N, Deangelis AP, Lay C, McKay JL, Nurmikko AV, Fellows MR, Simeral JD, Donoghue JP, Connors BW, Development of a chipscale integrated microelectrode/microelectronic device for brain implantable neuroengineering applications.IEEE Trans Neural Syst Rehabil Eng 13:2, 220-6 (2005 Jun) |
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