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ref: -0 tags: polyimide anodic release 2005 date: 06-16-2014 23:58 gmt revision:1 [0] [head]

IEEE-1416914 (pdf) Partial release and detachment of microfabricated metal and polymer structures by anodic metal dissolution

  • recommend 100nm Cr/Al release layer.
  • finished devices just 'float to the surface' of saline solution.