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ref: -0 tags: polyimide epoxy potassium hydroxide etch adhesion date: 06-25-2015 00:28 gmt revision:0 [head]

Improvement in the adhesion of polyimide/epoxy joints using various curing agents

  • Used 1M KOH, ~2min, followed by 0.2M HCl for 6 min to ring-open the imide.
  • PMDA/ODA polyimide (Pyromellitic Dianhydride, single aromatic ring + 4,4 diamino diphenyl ether )
  • Epoxy of the DGEBA + linear amide or aromatic (3,3 methylenedianiline)
  • Best result was with a polyamide curing agent, and high-temp curing profile. Unlikely that this will work for us, parylene will decompose..